Cure and Inert Oven

Cure and Inert Oven                                              Multi-Room Chamber for Save, Mass Production

•Cure for manufacturing process of BGA/CSP Flip chip         

•Microprocessor PID Temperature control up to 250°C
•High precision temperature uniformity and re Productivity  
•Rapid heat-up time to 250°C within 30 minutes
•Heavy duty stainless steel with chamber & durable exterior
•Easy to move and install with Foot master caster
•Built-in exhausted air damper from Dia 75 mm to 100 mm

•Safety and convenience with sliding lack shelf




















Model
LBO-4150C
Dimensions
(W x D x H mm)
Inner
500x500x600 150 Liters x 4 chambers
Outer
2000x1000x2000
Temperature


Range
Ambient +15°C to 250°C
Set Accuracy
±1.0°C
Uniformity
±2°C at 150°C
Controller
Microprocessor PID Program Controller with alarm system
Operation
Program/Reset, Local, Hold, Advance
Air Circulation Fan
Sirroco Fan 200W Motor x 4ea
Material

Interior
Stainless Steel
 Exterior
Epoxy powder coated EGI steel
Insulation
Glass Wool, thickness 80mm
Exhaust port
Volume adjustable damper Ø75mm
Over current breaker, signal lamp
Safety
Alarm for over heat and fan error
Over Current & Leakage Breaker, Hi-Low temp protector
Adjustable shelf
Perforated stainless steel shelves 2/each
Electrical Supply
220V or 380V 3 Ph 4 line, 50/60 Hz






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