Cure and Inert Oven
- Cure for manufacturing process of BGA/CSP Flip chip
- Microprocessor PID Temperature control up to 250°C
- High precision temperature uniformity and re Productivity
- Rapid heat-up time to 250°C within 30 minutes
- Heavy duty stainless steel with chamber & durable exterior
- Easy to move and install with Foot master caster
- Built-in exhausted air damper from Dia 75 mm to 100 mm
- Safety and convenience with sliding lack shelf
- 10 Step Microprocessor PID Program Controller RS-232/485 PC Interface
- Monitoring 16 Channel Connected into 1 Computers with Labtech Hub Software
- Graphic monitoring for step programmed process of time and temperature on reel-time
Specification
|
Model |
LBO-4150C |
|
Dimensions
Inner (W x
D x H mm) Outer |
500x500x600 150 Liters x 4 chambers 2000x1000x2000 |
|
Temperature
Range
Set Accuracy
Uniformity |
Ambient +15°C to 250°C ±1.0°C ±2°C at 150°C |
|
Controller |
Microprocessor PID Program Controller with
alarm system |
|
Operation |
Program/Reset, Local, Hold, Advance |
|
Air
Circulation Fan |
Sirroco Fan 200W Motor x 4ea |
|
Material
Interior
Exterior |
Stainless Steel Epoxy powder coated EGI steel |
|
Insulation |
Glass Wool, thickness 80mm |
|
Exhaust
port |
Volume adjustable damper Ø75mm Over current breaker, signal lamp |
|
Safety |
Alarm for over heat and fan error Over Current & Leakage Breaker, Hi-Low
temp protector |
|
Adjustable
shelf |
Perforated stainless steel shelves 2/each |
|
Electrical
Supply |
220V or 380V 3 Ph 4 line, 50/60 Hz |
