Cure and Inert Oven
- Cure for manufacturing process of BGA/CSP Flip chip
- Microprocessor PID Temperature control up to 250°C
- High precision temperature uniformity and re Productivity
- Rapid heat-up time to 250°C within 30 minutes
- Heavy duty stainless steel with chamber & durable exterior
- Easy to move and install with Foot master caster
- Built-in exhausted air damper from Dia 75 mm to 100 mm
- Safety and convenience with sliding lack shelf
- 10 Step Microprocessor PID Program Controller RS-232/485 PC Interface
- Monitoring 16 Channel Connected into 1 Computers with Labtech Hub Software
- Graphic monitoring for step programmed process of time and temperature on reel-time
Optional Accessories
Specification
Model |
LBO-4150C |
Dimensions Inner (WxDxHmm) Outer |
500x500x600 150
Liters x 4 chambers 2000x1000x2000 |
Temperature Range Set Accuracy Uniformity |
Ambient +15°C to
250°C ±1.0°C ±2°C at 150°C |
Controller |
Microprocessor PID
Program Controller with alarm system |
Operation |
Program/Reset, Local,
Hold, Advance |
Air Circulation Fan |
Sirroco Fan 200W
Motor x 4ea |
Material Interior
Exterior |
Stainless Steel Epoxy powder coated
EGI steel |
Insulation |
Glass Wool, thickness
80mm |
Exhaust port |
Volume adjustable
damper Ø75mm Over current breaker,
signal lamp |
Safety |
Alarm for over heat
and fan error Over Current &
Leakage Breaker, Hi-Low temp protector |
Adjustable shelf |
Perforated stainless
steel shelves 2/each |
Electrical Supply |
220V or 380V 3 Ph 4
line, 50/60 Hz |
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PT.TRIAS NATHOMI CHEMINDO
*JAKARTA: Jalan Industri KAV 9-11, Komplek GK Blok SB No.3
Kemayoran JAKARTA PUSAT; 10710;
www.triasnathomi.com
www.triasnathomichemindo.com
www.labindustri.com
www.peralatanlabs.com